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(parent: 30f2b22) | patch
kernel: modules: usb: Add DWC3 Qualcomm kmod
authorRobert Marko <robimarko@gmail.com>
Sun, 16 Dec 2018 22:06:17 +0000 (23:06 +0100)
committerChristian Lamparter <chunkeey@gmail.com>
Thu, 27 Dec 2018 13:06:38 +0000 (14:06 +0100)
commitc9f6116fd007ee360cbabf12ba830e3f381cee18
tree447799052bf934db275f0ed29b2472c486932419tree | snapshot
parent30f2b2295266b0ae2e542a14ec330d6b95612921commit | diff
kernel: modules: usb: Add DWC3 Qualcomm kmod

Since kernel 4.18 support for Qualcomm glue layer was
moved from DWC3 OF Simple to a separate DWC3 QCOM module.
So lets add it and make it depend on 4.19 kernel and make
sure that DWC3 OF Simple is not included if 4.19 is used.

Signed-off-by: Robert Marko <robimarko@gmail.com>
package/kernel/linux/modules/usb.mk diff | blob | history
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